Solder, method for processing surface of printed wiring board, and method for mounting electronic part
US6702176B2 · kind B2 · utility
2Cited by
2References
2Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 11, 2001 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Feb 3, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A solder consists essentially of 1.0% to 4.0% of Ag by mass, 0.2% to 1.3% of Cu by mass, 0.02% to 0.06% of Co by mass, and the remaining of Sn and inevitable impurities.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.