Conditioning wheel for conditioning a semiconductor wafer polishing pad and method of manufacture thereof
US6702654B2 · kind B2 · utility
3Cited by
5References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 7, 2001 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | May 3, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49888
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides an improved conditioning wheel for conditioning polishing pads used to polish semiconductor wafers. In one embodiment, the conditioning wheel includes a planar body having a metal surface located thereon. The metal surface has abrasive particles embedded therein and a retainer coating deposited over the metal surface and the abrasive particles. The retainer coating inhibits the abrasive particles from dislodging during a conditioning process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.