Process for producing a chip
US6702910B2 · kind B2 · utility
21Cited by
17References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 28, 2001 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Feb 18, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31703
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process for producing a chip, comprising the steps of:setting an object to be diced on a pressure sensitive adhesive sheet for producing chip comprising at least one layer of shrinkable film, an expansible film and a pressure sensitive adhesive layer for setting the object;fixing edges of the pressure sensitive adhesive sheet for producing chip;dicing the object into chips, andshrinking the shrinkable film to thereby expand chip spacings. In the process for producing small chips such as semiconductor chips, chip spacings can be expanded without the need to conduct the conventional expansion step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.