Method and system for processing substrate
US6703316B2 · kind B2 · utility
21Cited by
13References
18Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 26, 2002 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Apr 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67028
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and system for processing a substrate includes performing a wet process by supplying a working liquid to a substrate in a wet processing apparatus, transferring the substrate in a non-dry state from the wet processing apparatus to a drying apparatus, and subjecting the substrate to a supercritical drying by a supercritical fluid in the drying apparatus.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.