Stress resistant land grid array (LGA) module and method of forming the same
US6703560B2 · kind B2 · utility
6Cited by
9References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2001 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Apr 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/301
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An integrated circuit module, a land grid array module, and a method for forming the module, include a substrate, which mounts one or more chips or discrete electronic components, and a cap for covering the substrate, and including at least one protrusion coupled to the cap for limiting the amount of flexing of the substrate during actuation. The at least one protrusion can be either rigidly fixed to the cap or adjustably inserted through the cap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.