Semiconductor device having radiation structure
US6703707B1 · kind B1 · utility
66Cited by
22References
57Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 22, 2000 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Aug 20, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/351
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes two semiconductor chips that are interposed between a pair of radiation members, and thermally and electrically connected to the radiation members. One of the radiation members has two protruding portions and front ends of the protruding portions are connected to principal electrodes of the semiconductor chips. The radiation members are made of a metallic material containing Cu or Al as a main component. The semiconductor chips and the radiation members are sealed with resin with externally exposed radiation surfaces.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.