IC package with edge connect contacts
US6704204B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 23, 1998 |
| Grant date | Mar 9, 2004 |
| Priority date | — |
| Expiry date | Jun 23, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01R13/665
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An apparatus and method for allowing the lead pins of an integrated circuit (IC) package to provide the electrical interface between the IC package and a receptacle of the host data processing system is described. The present invention comprises an IC package housed within a card casing to form an IC card, with the leads from the IC package providing the electrical interface between the IC card and the data processing system into which the IC card is inserted. Thus, the present invention eliminates the need for a printed circuit board (PCB) and connector to provide the interconnection between the IC package and the data processing system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.