Electronic assembly with high capacity thermal spreader and methods of manufacture
US6706562B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 21, 2001 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Feb 5, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to an integrated heat spreader (IHS) through a high capacity thermal spreader formed of diamond, a diamond composite, or graphite. In one embodiment, a diamond layer is grown on the IHS. In another embodiment, a diamond layer is separately formed and affixed to the IHS and/or to the die through soldering or through a room temperature surface activated bonding (SAB) process. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.