Chip interconnect bus
US6707077B2 · kind B2 · utility
3Cited by
13References
45Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 16, 2002 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Mar 16, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10B99/10
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An interconnect bus for a microelectromechanical system is disclosed. Various attributes for an electrical trace bus that facilitate the routing of signals throughout at least a portion of the system and/or the layout of the microelectromechanical system on a wafer are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.