Optical module package of flip chip bonding
US6707161B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2002 |
| Grant date | Mar 16, 2004 |
| Priority date | — |
| Expiry date | Jun 27, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1532
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A flip-chip-bonded optical module package using flip chip bonding is provided. The flip-chip-bonded optical module package includes an optical device chip which has an input/output pad formed on a substrate, an under bump metal layer fanned on the input/output pad, and a solder bump formed on the under bump metal layer to transmit an electric signal to the outside. The flip-chip-bonded optical module package includes a silicon wafer through which a through hole is formed, on which an under ball metal layer is formed, and to which the optical device chip is flip-chip-banded. The flip-chip-banded optical module package includes a solder ball which is fanned on the under ball metal layer and transmits an electrical signal from the solder bump to the outside, and an optical fiber which is inserted into the through hole and is optically coupled with the optical device chip. Accordingly, it is possible to satisfy the electrical characteristics of a high speed optical device chip using flip chip banding and increase the efficiency of an optical device chip to be coupled with an optical fiber by simply inserting the optical fiber into a through hole of a silicon wafer to be passively align…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.