Spacer plate solder ball placement fixture and methods therefor
US6709469B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 30, 2000 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Aug 30, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0557
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A stencil assembly for placing conductive elements over conductive pads accessible at a first surface of a microelectronic element includes a main body having a top surface and a bottom surface and a plurality of openings extending between the top and bottom surfaces, the main body being adapted for overlying the first surface of the microelectronic element so that the openings are in substantial alignment with the pads of the microelectronic element. The stencil assembly also includes a spacer element under the bottom surface of the main body, the spacer element being adapted for maintaining the main body above the first surface of the microelectronic element and remote from the pads of the microelectronic element. The main body and the spacer element have a combined thickness that is substantially equivalent to the diameter of the conductive elements.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.