Measurement of the concentration of a reducing agent in an electroless plating bath
US6709561B1 · kind B1 · utility
18Cited by
2References
28Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Nov 6, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N27/42
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The concentration of a reducing agent in an electroless bath for plating a first metal is determined from the effect of the reducing agent on the electrodeposition rate of a second metal. For electroless cobalt and nickel baths, a sample of the electroless plating bath is added to an acid copper plating solution and the copper electrodeposition rate is measured by cyclic voltammetric stripping (CVS) analysis. Separate analyses for hypophosphite and dimethylamineborane in baths employing both reducing agents are attained via selective decomposition of the dimethylamineborane in acidic solution.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.