ECI TECHNOLOGY, INC.
21Patents
12Active
21Granted
42Portfolio score
Filing activity: Oct 1, 2001 → Sep 27, 2019 · 5 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6709561B1 | Measurement of the concentration of a reducing agent in an electroless plating bath | Physics | 18 | Expired |
| US6572753B2 | Method for analysis of three organic additives in an acid copper plating bath | Chemistry; Metallurgy | 18 | Expired |
| US6673226B1 | Voltammetric measurement of halide ion concentration | Emerging Cross-Sectional Technologies | 12 | Expired |
| US7186326B2 | Efficient analysis of organic additives in an acid copper plating bath | Physics | 10 | Expired |
| US8008087B1 | Analysis of silicon concentration in phosphoric acid etchant solutions | Emerging Cross-Sectional Technologies | 9 | Active |
| US6890758B2 | Measurement of complexing agent concentration in an electroless plating bath | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6749739B2 | Detection of suppressor breakdown contaminants in a plating bath | Chemistry; Metallurgy | 7 | Expired |
| US7291253B2 | Detection of an unstable additive breakdown product in a plating bath | Chemistry; Metallurgy | 6 | Expired |
| US7879222B2 | Detection of additive breakdown products in acid copper plating baths | Chemistry; Metallurgy | 4 | Active |
| US7351349B2 | Method and apparatus for real-time dynamic chemical analysis | Physics | 3 | Expired |
| US8118988B2 | Analysis of copper ion and complexing agent in copper plating baths | Physics | 2 | Active |
| US6733656B2 | Voltammetric reference electrode calibration | Physics | 2 | Expired |
| US9274079B2 | Etchant product analysis in alkaline etchant solutions | Physics | 1 | Active |
| US8535504B2 | Analysis of an auxiliary leveler additive in an acid copper plating bath | Physics | 1 | Active |
| US8142640B2 | Chloride analysis in acid copper plating baths | Chemistry; Metallurgy | 1 | Active |
| US7932094B2 | Method and apparatus for determining the stability of an electroless plating bath | Chemistry; Metallurgy | 0 | Active |
| US10920336B2 | Analysis of silver ion and complexing agent in tin-silver electrodeposition solution | Physics | 0 | Active |
| US11555798B2 | Selective monitoring of multiple silicon compounds | Electricity | 0 | Active |
| US10590560B1 | Control of additive turnover in an electrodeposition solution | Physics | 0 | Active |
| US9593931B2 | Palladium coating thickness measurement | Physics | 0 | Active |
| US10407795B2 | Analysis of silver ion and complexing agent in tin-silver electrodeposition solution | Physics | 0 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.