Method of manufacturing semiconductor integrated circuit device
US6709890B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 15, 2001 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Feb 15, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/341
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a method of manufacturing a high frequency module to be assembled by providing, on a wiring board, a chip part and a semiconductor pellet to be bare chip mounted and then mounting the chip part and the semiconductor pellet through soldering, the wiring board is separated from a heat block with the semiconductor pellet pressurized against the wiring board in a main heating portion heating and melting a reflow solder, thereby cooling a soldering portion. Consequently, the generation of a void in the soldering portion can be prevented and the connecting reliability of the soldering portion can be enhanced. In addition, a degree of mounting horizontality of the semiconductor pellet on the wiring board can be enhanced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.