Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device
US6709966B1 · kind B1 · utility
17Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2000 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Dec 20, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/104
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device comprising the bump containing magnetic body, magnetic body, the bump including non-magnetic body for at least partially covering the magnetic body, mixture of magnetic particles and non-magnetic particles and the bump including baked magnetic particles and baked non-magnetic particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.