Mie Matsuo
58Patents
17h-index
88Co-inventors
87Inventor score
Filing activity: Jul 30, 1993 → Nov 27, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6809421B1 | Multichip semiconductor device, chip therefor and method of formation thereof | Electricity | 307 | Expired |
| US7053456B2 | Electronic component having micro-electrical mechanical system | Electricity | 100 | Expired |
| US5607718A | Polishing method and polishing apparatus | Electricity | 78 | Expired |
| US5775980A | Polishing method and polishing apparatus | Electricity | 66 | Expired |
| US5731634A | Semiconductor device having a metal film formed in a groove in an insulating film | Electricity | 61 | Expired |
| US6717251B2 | Stacked type semiconductor device | Electricity | 55 | Expired |
| US6791175B2 | Stacked type semiconductor device | Electricity | 48 | Expired |
| US6504227B1 | Passive semiconductor device mounted as daughter chip on active semiconductor device | Emerging Cross-Sectional Technologies | 43 | Expired |
| US7019364B1 | Semiconductor substrate having pillars within a closed empty space | Physics | 37 | Expired |
| US5561082A | Method for forming an electrode and/or wiring layer by reducing copper oxide or silver oxide | Electricity | 32 | Expired |
| US5424246A | Method of manufacturing semiconductor metal wiring layer by reduction of metal oxide | Electricity | 31 | Expired |
| US6734568B2 | Semiconductor device and method of manufacturing the same | Electricity | 28 | Expired |
| US7427797B2 | Semiconductor device having actuator | Electricity | 28 | Expired |
| US7235456B2 | Method of making empty space in silicon | Physics | 25 | Expired |
| US6991964B2 | Stacked type semiconductor device | Electricity | 19 | Expired |
| US7507634B2 | Method for fabricating a localize SOI in bulk silicon substrate including changing first trenches formed in the substrate into unclosed empty space by applying heat treatment | Physics | 19 | Active |
| US7808064B2 | Semiconductor package including through-hole electrode and light-transmitting substrate | Electricity | 18 | Active |
| US6709966B1 | Semiconductor device, its manufacturing process, position matching mark, pattern forming method and pattern forming device | Electricity | 17 | Expired |
| US7829975B2 | Multichip semiconductor device, chip therefor and method of formation thereof | Electricity | 15 | Active |
| US6812557B2 | Stacked type semiconductor device | Electricity | 15 | Expired |
| US7402903B2 | Semiconductor device | Electricity | 12 | Expired |
| US7095112B2 | Semiconductor device, semiconductor package member, and semiconductor device manufacturing method | Electricity | 12 | Expired |
| US8283755B2 | Multichip semiconductor device, chip therefor and method of formation thereof | Electricity | 10 | Active |
| US7238919B2 | Heating element movement bonding method for semiconductor components | Emerging Cross-Sectional Technologies | 10 | Expired |
| US7335517B2 | Multichip semiconductor device, chip therefor and method of formation thereof | Electricity | 10 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.