Chip scale marker and making method
US6710286B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 3, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Sep 3, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Provided is a chip scale marker and a marking method. The method for marking, using a chip scale marker, wherein a laser beam is irradiated from a laser source on the wafer chips via a galvano scanner and an f-theta lens, the method comprising: (a) measuring position information of a plurality of points on the wafer; (b) transmitting the measured position information to a controller; (c) calculating a deviation between a marking distance between the f-theta lens and the point on the wafer surface and a focus distance of the f-theta lens from the transmitted position information; and (d) if the deviation is greater than a predetermined value in the step (c), calibrating the wafer chip to be positioned at the focus distance of the f-theta lens. According to the chip scale marker, it is possible to increase marking quality by measuring and calibrating a vertical distance from an f-theta lens of the laser system to each wafer chip so that the wafer chip is marked at a predetermined distance from the f-theta lens of the laser system.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.