Window-type semiconductor package and fabrication method thereof
US6710434B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Sep 30, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01087
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A window-type semiconductor package and a fabrication method thereof are provided. A substrate having an opening is mounted with at least a chip in a manner that, a conductive area of an active surface of the chip is exposed to the opening, and electrically connected to the substrate by bonding wires formed through the opening. A non-conductive material is applied over the conductive area of the chip. An upper encapsulant is formed to encapsulate the chip, and a lower encapsulant is formed to encapsulate the bonding wires and the non-conductive material. The non-conductive material interposed between the chip and the lower encapsulant helps prevent the chip from cracking at end portions thereof due to shrinkage of the lower encapsulant, and also helps secure the bonding wires in position within the opening of the substrate without causing wire-sweeping, such that reliability and yield of the semiconductor package can be assured.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.