Ultratera Corporation
27Patents
0Active
27Granted
31Portfolio score
Filing activity: Apr 23, 2002 → Nov 2, 2004
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6713856B2 | Stacked chip package with enhanced thermal conductivity | Electricity | 82 | Expired |
| US7224073B2 | Substrate for solder joint | Emerging Cross-Sectional Technologies | 66 | Expired |
| US6713857B1 | Low profile stacked multi-chip semiconductor package with chip carrier having opening and fabrication method of the semiconductor package | Electricity | 48 | Expired |
| US6614660B1 | Thermally enhanced IC chip package | Electricity | 44 | Expired |
| US6683385B2 | Low profile stack semiconductor package | Electricity | 20 | Expired |
| US6849915B1 | Light sensitive semiconductor package and fabrication method thereof | Electricity | 18 | Expired |
| US6753480B2 | Printed circuit board having permanent solder mask | Emerging Cross-Sectional Technologies | 15 | Expired |
| US6849932B2 | Double-sided thermally enhanced IC chip package | Electricity | 14 | Expired |
| US6555919B1 | Low profile stack semiconductor package | Electricity | 11 | Expired |
| US7091623B2 | Multi-chip semiconductor package and fabrication method thereof | Electricity | 11 | Expired |
| US6897566B2 | Encapsulated semiconductor package free of chip carrier | Electricity | 7 | Expired |
| US6709894B2 | Semiconductor package and method for fabricating the same | Electricity | 5 | Expired |
| US6879030B2 | Strengthened window-type semiconductor package | Electricity | 5 | Expired |
| US6933178B1 | Method of manufacturing semiconductor packages and a clamping device for manufacturing a semiconductor package | Electricity | 5 | Expired |
| US6857865B2 | Mold structure for package fabrication | Electricity | 5 | Expired |
| US6911604B2 | Bonding pads of printed circuit board capable of holding solder balls securely | Electricity | 4 | Expired |
| US6710434B1 | Window-type semiconductor package and fabrication method thereof | Electricity | 4 | Expired |
| US6822337B2 | Window-type ball grid array semiconductor package | Electricity | 4 | Expired |
| US7122407B2 | Method for fabricating window ball grid array semiconductor package | Electricity | 4 | Expired |
| US6956741B2 | Semiconductor package with heat sink | Electricity | 3 | Expired |
| US6859056B2 | Test fixture for semiconductor package and test method of using the same | Physics | 2 | Expired |
| US6968613B2 | Fabrication method of circuit board | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6964888B2 | Semiconductor device and method for fabricating the same | Electricity | 2 | Expired |
| US7080447B2 | Method of manufacturing solder mask of printed circuit board | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6740540B2 | Fabrication method for circuit board | Emerging Cross-Sectional Technologies | 1 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.