Test head Hifix for semiconductor device testing apparatus
US6710590B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 12, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Dec 12, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R31/2851
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention is directed to a test head Hifix of a semiconductor device testing apparatus that does not require disassembly for maintenance or repair of the semiconductor device testing apparatus. In one embodiment, the test head Hifix of a semiconductor device testing apparatus includes a plate that resides as the top surface of a test head and on which the assembly, loadboard, socket and DUT are mounted. The plate is attached to the test head in an arrangement that allows the plate along with the assembly, loadboard, socket and DUT to be easily moved without completely disassembling the plate, assembly and loadboard from the test head. In one embodiment, the plate is attached or coupled to the test head by hinges.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.