Method for improved dielectric layer metrology calibration
US6710889B2 · kind B2 · utility
3Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 2, 2002 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Jul 2, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B11/0616
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for measuring a dielectric layer thickness calibration reference standard including providing a substrate having a dielectric layer for calibrating a dielectric layer thickness measuring tool; cleaning the dielectric layer according to a cleaning process including at least one of spraying and scrubbing; and, measuring the thickness of the dielectric layer with the dielectric layer thickness measuring tool including at least one portion of the dielectric layer displaced from the substrate center.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.