Systems and methods that use at least one component to remove the heat generated by at least one other component
US6711021B1 · kind B1 · utility
8Cited by
13References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 15, 2003 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | Jan 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10515
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One embodiment of the invention is a system comprising a first component that generates heat, and a second component that is thermally connected to the first component, wherein the from the first component is transferred to a coolant through the second component, and the second component has a function in the computer system associated with an operation of the system other than transferring heat.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.