Modules having paths of different impedances
US6711027B2 · kind B2 · utility
8Cited by
37References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2001 |
| Grant date | Mar 23, 2004 |
| Priority date | — |
| Expiry date | May 11, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10022
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In some embodiments, the invention includes a module including a circuit board and first and second groups of conductors supported by the circuit board. A first group of chips each include on die terminations that are enabled. At least some of a second group of chips have on die terminations that are disabled. The first group of chips are coupled to conductors of the first group of conductors and the second group of chips are coupled to conductors of the second group of conductors, and wherein the second group of conductors have higher impedances than do the first group of conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.