Bonding method and apparatus
US6712111B2 · kind B2 · utility
2Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 11, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | May 17, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/12
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A carrier tool having a protective ring with a sheet extended over an underside of the ring is used, a semiconductor wafer is made to adhere to the sheet, the semiconductor wafer, being surrounded by the protective ring, is carried from a container device to a bonding stage. Bonding is performed on the bonding stage, and the wafer is carried out to another container device, consequently damage of the wafer is avoided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.