Indirect imaging method for a bonding tool
US6712257B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Mar 23, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/40
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A vision system and method for use with a bonding tool that takes into account variations due to temperature changes and other nonrandom systemic effects. The vision system includes a cornercube offset tool having a plurality of total internal reflection surfaces, the cornercube offset tool located below the vision plane of the optical system; and an optical detector to receive an indirect image of the bonding tool through the cornercube offset tool. The method comprises the steps of providing a cornercube offset tool having a plurality of total internal reflection surfaces below a vision plane of the bonding tool; and receiving an indirect image of the bonding tool through the cornercube offset tool.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.