James E. Eder
14Patents
5h-index
11Co-inventors
63Inventor score
Filing activity: Sep 20, 1994 → May 12, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US5562788A | Composite material laser flaw detection | Emerging Cross-Sectional Technologies | 102 | Expired |
| US8723355B2 | Autonomously operated buoys with power generation and power usage control | Emerging Cross-Sectional Technologies | 15 | Active |
| US7137543B2 | Integrated flexure mount scheme for dynamic isolation of ultrasonic transducers | Electricity | 11 | Expired |
| US8487459B2 | Wave energy converter and power take off system | Emerging Cross-Sectional Technologies | 9 | Active |
| US7320425B2 | Low-profile capillary for wire bonding | Electricity | 7 | Expired |
| US8723351B2 | Multi-mode wave energy converter devices and systems | Emerging Cross-Sectional Technologies | 4 | Active |
| US6412683B1 | Cornercube offset tool | Performing Operations; Transporting | 3 | Expired |
| US6705507B2 | Die attach system and process using cornercube offset tool | Electricity | 1 | Expired |
| US7500591B2 | Low-profile capillary for wire bonding | Electricity | 0 | Active |
| US6712257B2 | Indirect imaging method for a bonding tool | Performing Operations; Transporting | 0 | Expired |
| US10692783B2 | Systems and methods for bonding semiconductor elements | Electricity | 0 | Active |
| US6778274B2 | Die attach process using cornercube offset tool | Electricity | 0 | Expired |
| US11295996B2 | Systems and methods for bonding semiconductor elements | Electricity | 0 | Active |
| US6641026B2 | Indirect imaging system for a bonding tool | Performing Operations; Transporting | 0 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.