Solid conductive element insertion apparatus
US6712261B2 · kind B2 · utility
17Cited by
4References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 20, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Aug 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10287
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An arrangement and method for the insertion the leading end of a length of a metallic element into a through hole which is formed in a substrate, and for heat deforming the inserted leading portion of the metallic element into a predetermined configuration prior to severing therefrom the remaining length of the metallic element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.