Ronald V. Smith
6Patents
3h-index
13Co-inventors
50Inventor score
Filing activity: Mar 16, 2001 → Jul 16, 2010
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6721187B2 | Multi-layered high density connections | Electricity | 51 | Expired |
| US6712261B2 | Solid conductive element insertion apparatus | Electricity | 17 | Expired |
| US7441709B2 | Electronic card assembly | Physics | 13 | Active |
| US7629559B2 | Method of improving electrical connections in circuitized substrates | Electricity | 3 | Active |
| US6982387B2 | Method and apparatus to establish circuit layers interconnections | Electricity | 1 | Expired |
| US8240031B2 | Method of joining a semiconductor device/chip to a printed wiring board | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.