Polishing apparatus, polishing head and method
US6712673B2 · kind B2 · utility
5Cited by
24References
44Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2001 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Mar 3, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/16
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A wafer polishing apparatus for polishing a semiconductor wafer. The polisher comprises a base, a turntable, a polishing pad and a head drive mechanism for driven rotation of a polishing head. The polishing head comprises a sealing ring adapted to hold at least one wafer for engaging a front surface of the wafer with a work surface of the polishing pad. The sealing ring allows for application of uniform air pressure over the rear surface of the wafer. The sealing ring is constructed so that the wafer itself defines a portion of a pressure cavity receiving pressurized air.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.