Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator
US6713314B2 · kind B2 · utility
57Cited by
5References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 14, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Aug 17, 2022 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2207/096
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A film bulk acoustic resonator wafer and microelectromechanical switch wafer may be combined together in face-to-face abutment with sealing material between the wafers to define individual modules. Electrical interconnects can be made between the switch and the film bulk acoustic resonator within a hermetically sealed chamber defined between the switch and the film bulk acoustic resonator.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.