John Heck
68Patents
16h-index
99Co-inventors
87Inventor score
Filing activity: Mar 26, 2002 → Dec 28, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8620164B2 | Hybrid III-V silicon laser formed by direct bonding | Electricity | 204 | Active |
| US6852926B2 | Packaging microelectromechanical structures | Electricity | 86 | Expired |
| US6903452B2 | Packaging microelectromechanical structures | Electricity | 74 | Expired |
| US6812814B2 | Microelectromechanical (MEMS) switching apparatus | Electricity | 62 | Expired |
| US6713314B2 | Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator | Performing Operations; Transporting | 57 | Expired |
| US10310196B2 | Monolithic physically displaceable optical waveguides | Physics | 32 | Active |
| US9575341B2 | Solid state LIDAR circuit with waveguides tunable to separate phase offsets | Physics | 31 | Active |
| US7183622B2 | Module integrating MEMS and passive components | Emerging Cross-Sectional Technologies | 29 | Expired |
| US7368808B2 | MEMS packaging using a non-silicon substrate for encapsulation and interconnection | Electricity | 29 | Expired |
| US7061099B2 | Microelectronic package having chamber sealed by material including one or more intermetallic compounds | Emerging Cross-Sectional Technologies | 27 | Expired |
| US6686820B1 | Microelectromechanical (MEMS) switching apparatus | Electricity | 27 | Expired |
| US6673697B2 | Packaging microelectromechanical structures | Electricity | 26 | Expired |
| US9823118B2 | Low power, high resolution solid state LIDAR circuit | Physics | 22 | Active |
| US6806543B2 | Microfluidic apparatus with integrated porous-substrate/sensor for real-time (bio)chemical molecule detection | Emerging Cross-Sectional Technologies | 22 | Expired |
| US7283024B2 | MEMS switch stopper bumps with adjustable height | Electricity | 18 | Expired |
| US7321275B2 | Ultra-low voltage capable zipper switch | Electricity | 18 | Expired |
| US7170155B2 | MEMS RF switch module including a vertical via | Electricity | 14 | Expired |
| US10281322B2 | Low power, high resolution solid state LIDAR circuit having a modulator to modulate a bit sequence onto a carrier frequency of a received optical signal | Physics | 12 | Active |
| US6943419B2 | Hermetically packaging a microelectromechanical switch and a film bulk acoustic resonator | Performing Operations; Transporting | 12 | Expired |
| US8435809B2 | Vertical mirror in a silicon photonic circuit | Physics | 10 | Active |
| US9239340B2 | Optomechanical sensor for accelerometry and gyroscopy | Physics | 9 | Active |
| US7687297B2 | Forming a cantilever assembly for vertical and lateral movement | Performing Operations; Transporting | 8 | Active |
| US7324350B2 | MEMS RF switch module including a vertical via | Electricity | 8 | Active |
| US6967548B2 | Microelectromechanical (MEMS) switching apparatus | Electricity | 7 | Expired |
| US7510907B2 | Through-wafer vias and surface metallization for coupling thereto | Electricity | 6 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.