Electrodepositable dielectric coating compositions and methods related thereto
US6713587B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Jun 27, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31688
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to an electrodepositable coating composition having a resinous phase dispersed in an aqueous medium. The resinous phase includes (a) an ungelled, active hydrogen-containing, ionic salt group-containing resin; and (b) a curing agent reactive with the active hydrogens of the resin (a). The resinous phase has a covalently bonded halogen content based on total weight of resin solids present in the resinous phase such that when the composition is electrodeposited and cured, the cured film passes flame resistance testing in accordance with IPC-TM-650, and has a dielectric constant of less than or equal to 3.50. The invention also is directed to a method for forming a dielectric coating on an electroconductive substrate using the electrodepositable coating composition, as well as to a substrate coated with the electrodepositable composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.