Kevin C. Olson
27Patents
5h-index
32Co-inventors
65Inventor score
Filing activity: Dec 16, 1999 → Oct 18, 2011
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7745508B2 | Compositions and methods for coating food cans | Chemistry; Metallurgy | 16 | Expired |
| US7803415B2 | Methods for coating food cans | Chemistry; Metallurgy | 15 | Active |
| US6590049B1 | Multi-functional initiators for atom transfer radical (Co)polymerization | Chemistry; Metallurgy | 13 | Expired |
| US6844504B2 | Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6326420A | Pigment dispersions containing dispersants prepared by controlled radical polymerization | Chemistry; Metallurgy | 7 | Expired |
| US6824959B2 | Process for creating holes in polymeric substrates | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7000313B2 | Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6713587B2 | Electrodepositable dielectric coating compositions and methods related thereto | Emerging Cross-Sectional Technologies | 4 | Expired |
| US7690103B2 | Method of forming a printed circuit board with improved via design | Emerging Cross-Sectional Technologies | 4 | Active |
| US7002081B2 | Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6951707B2 | Process for creating vias for circuit assemblies | Emerging Cross-Sectional Technologies | 4 | Expired |
| US6671950B2 | Multi-layer circuit assembly and process for preparing the same | Emerging Cross-Sectional Technologies | 4 | Expired |
| US8563648B2 | Coating composition comprising an alkoxysilane, a polysiloxane, and a plurality of particles | Chemistry; Metallurgy | 3 | Active |
| US7485812B2 | Single or multi-layer printed circuit board with improved via design | Electricity | 2 | Expired |
| US8008188B2 | Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials | Electricity | 2 | Active |
| US7743494B2 | Process of fabricating a circuit board | Emerging Cross-Sectional Technologies | 2 | Active |
| US8258411B2 | Printed circuit board with improved via design | Emerging Cross-Sectional Technologies | 2 | Active |
| US7666945B2 | Non-gelled curable compositions containing imide functional compositions | Chemistry; Metallurgy | 2 | Active |
| US7679001B2 | Circuit board and method of manufacture thereof | Emerging Cross-Sectional Technologies | 1 | Active |
| US8629218B2 | Curable film-forming compositions containing ortho-hydroxyl aromatic functional acrylic polymers | Emerging Cross-Sectional Technologies | 1 | Active |
| US8141245B2 | Method of forming a circuit board with improved via design | Emerging Cross-Sectional Technologies | 1 | Active |
| US7294683B2 | Non-gelled curable compositions containing imide functional compounds | Chemistry; Metallurgy | 1 | Expired |
| US8598467B2 | Multi-layer circuit assembly and process for preparing the same | Emerging Cross-Sectional Technologies | 0 | Active |
| US7228623B2 | Process for fabricating a multi layer circuit assembly | Emerging Cross-Sectional Technologies | 0 | Expired |
| US8409982B2 | Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.