Non-circular micro-via
US6713685B1 · kind B1 · utility
44Cited by
6References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 10, 2001 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | May 10, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09981
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Non-circular vias and methods of cutting away material in a printed circuit board (PCB) so as to form non-circular vias. Laser ablation or plasma ablation is used to remove PCB material about a centerline. This type of material removal allows lateral movement to effect non-circular patterns. Exemplary shapes are convoluted circle vias, square vias, extended/elongated vias, and trench vias. The trench vias may be micro milled to form a coaxialised structure that provides noise suppression and EMI protection, and are elongated to be even greater than three times the diameter of a circular micro-via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.