Method for manufacturing an extended-wing capacitor and the extended-wing capacitor
US6713806B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 26, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Apr 26, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/682
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This is related to a method for the manufacture of a capacitor with wing extensions and the capacitor device. The method comprises: (1) causing multiple contact areas to be disposed in alternate positions, such that two adjacent contact areas are complements of each other, (2) depositing electroplating base material (EBM) over the contact area, (3) electroplating a conductive material on the sidewalls of the EBM slab to form plate electrode; and then (4) etching back the EBM leaving only the electrode portion. The capacitor formed by the above method has a larger surface area on the electrode compared with that made by the conventional method, and the cell capacitance is also better. This method is especially effective for the manufacture of high-density memory device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.