Semiconductor utilizing grooves in lead and tab portions of lead frame to prevent peel off between the lead frame and the resin
US6713849B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 20, 2001 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Nov 20, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49121
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a non-leaded type semiconductor device, a tab, tab suspension leads, and other leads are exposed to one surface of a seal member. A semiconductor element is positioned within the seal member and fixed to a surface of the tab with an adhesive. The tab is formed larger than the semiconductor element so that outer peripheral edges of the tab are positioned outside outer peripheral edges of the semiconductor element. A groove is formed in the tab surface portion positioned between the area to which the semiconductor element is fixed and wire connection areas to which the wires are connected, the groove being formed so as to surround the semiconductor element fixing area, thereby preventing peeling-off between the tab to which the semiconductor element is fixed and the resin which constitutes the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.