Optical semiconductor housing and method for making same
US6713876B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2002 |
| Grant date | Mar 30, 2004 |
| Priority date | — |
| Expiry date | Oct 1, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Optical semiconductor package and process for fabricating an optical semiconductor package, in which an electrical connection support plate (2) has a through-passage (5); a first semiconductor component (4) such as a microprocessor placed behind the support plate and lying opposite the through-passage; electrical connection metal balls (9) inserted into the annular space separating the first component from the support plate; encapsulation mechanism including an encapsulation material (12) lying in the annular space; a second semiconductor component (13), a front face (15) of which has an optical sensor and a rear face of which is fixed to the front face (20) of the first component (4) through the through-passage (5) of the support plate (2); metal electrical connection wires (17) connecting the front face of the second component and the front face of the support plate; a front encapsulation lid (21) which covers the through-passage and the metal wires at some distance and which has at least one transparent part (23) lying in front of the optical sensor, and external electrical connection (25) located on an exposed part of the support plate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.