DFR laminating and film removing system
US6715524B2 · kind B2 · utility
7Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 7, 2002 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Jul 5, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1712
- WIPO fieldHandling
- WIPO sectorMechanical engineering
Abstract
A DFR laminating and PET removing system which is capable of both laminating a dry film resist (DFR) layer on a semiconductor wafer and removing a DFR support film such as polyethylene terepthalate (PET) from the DFR layer on the wafer at a single location. The DFR laminating and PET removing system of the present invention comprises a PET support film removing head for removing a portion of PET film from the semiconductor wafer substrate after the PET film portion and dry film resist (DFR) portion are laminated from a DFR tape onto the wafer and before the DFR portion is cut from the DFR tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.