Electroless plating liquid and semiconductor device
US6717189B2 · kind B2 · utility
258Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2001 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Sep 18, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an electroless-plating liquid useful for forming a protective film for selectively protecting surface of exposed interconnects of a semiconductor device which has an embedded interconnect structure formed by an electric conductor, such as copper or silver, embedded in fine recesses for interconnects formed in a surface of a semiconductor substrate, and also to a semiconductor device in which surfaces of exposed interconnects are selectively protected with a protective film. The electroless-plating liquid contains cobalt ions, a complexing agent and a reducing agent containing no alkali metal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.