Temperature-protected semiconductor circuit configuration
US6717788B2 · kind B2 · utility
4Cited by
2References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 15, 2001 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | Jan 27, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03K2017/0806
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A temperature-protected semiconductor circuit configuration that has an integrated switching unit. The switching unit is formed of a semiconductor switch, a first integrated temperature sensor for driving the semiconductor switch when an over-temperature is reached, first and second connecting terminals for connecting a load, and a control terminal for applying a drive signal for the semiconductor switch. A second temperature sensor is connected in a heat-conducting manner to the switching unit which exhibits at least one output terminal for providing a temperature-dependent temperature signal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.