Method of processing semiconductor wafer and semiconductor wafer supporting member
US6718223B1 · kind B1 · utility
8Cited by
15References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2000 |
| Grant date | Apr 6, 2004 |
| Priority date | — |
| Expiry date | May 17, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67294
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of processing a semiconductor wafer. The wafer is secured to a wafer supporting member having a data carrier. Information required for working the semiconductor wafer is input to the data carrier. The wafer is then worked according to information read from the data carrier. The data carrier is configured to permit operations such as back grinding, dicing and pickup of the wafer, and prevents wafer breakage when the wafer is carried between different operations.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.