Patent · US Expired

Carrier element for a semiconductor chip for incorporation into smart cards

US6719205B1 · kind B1 · utility

6Cited by

8References

13Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Frank Puschner · Kelheim, DE
Jurgen Fischer · Backnang, DE
Josef Heitzer · Neutraubling, DE

Key dates

Filing date	Jun 15, 1999
Grant date	Apr 13, 2004
Priority date	—
Expiry date	Feb 7, 2020

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49146
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A carrier element for a semiconductor chip and in particular for incorporation into smart cards. The carrier element has an encapsulation composition protecting the semiconductor chip. The carrier element connections are disposed on one of the main surfaces of the encapsulation composition along only two opposite edges. They are made of a conductive material and have a reduced thickness at the ends facing one another, the cross section having a step only on one side. The semiconductor chip is disposed on the connections in a region of the section of reduced thickness and is mechanically connected to the connections.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.