Resin composition, and use and method for preparing the same
US6720077B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 13, 2002 |
| Grant date | Apr 13, 2004 |
| Priority date | — |
| Expiry date | Feb 13, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31529
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.