Patent · US Expired

High density probe card apparatus and method of manufacture

US6720780B2 · kind B2 · utility

0Cited by
2References
25Claims
0Family size

Assignee

Inventors

Key dates

Filing dateAug 2, 2001
Grant dateApr 13, 2004
Priority date
Expiry dateNov 22, 2021

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R1/07378
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

A high density probe card contact apparatus including a support block fitted into an opening in a probe card, and holding a plurality of fine tipped needles extending inward and below an opening in the center of the block. The needle tips are a noble metal integrally connected with a less costly conductive metal which forms the more widely spaced fingers of the needles, and which terminate in contacts to the probe card. Laser etching defines the fine needle pattern in a thin sheet of the two-metal composition which is secured to a polymeric film. The contact apparatus is assembled by positioning one or more sections of the polymer with needles on the support film.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.