Apparatus and method for removably adhering a semiconductor substrate to a substrate support
US6722026B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 25, 2001 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Feb 11, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/23914
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A process and apparatus is disclosed capable of removably adhering a semiconductor substrate to a substrate support in a sub-atmospheric environment using a plurality of individual fibers, each mounted at one end adjacent the substrate support, and each having a loose end. When the portions of the fiber adjacent the loose fiber ends are each brought into contact with the under surface of the substrate, Van der Waals forces are exerted between the substrate and the fibers to urge the substrate toward the underlying substrate support. In a preferred embodiment, the substrate and portions of the fiber adjacent the loose fiber ends are first vertically brought into physical contact with one another, and then a horizontal force is applied to horizontally move, with respect to one another, the substrate and the portions of the fibers adjacent the loose fiber ends. After application of the horizontal force, a vertical force is applied between the substrate and the fibers of sufficient strength to urge the substrate and the fibers away from one another without breaking contact between the substrate and the portions of the fiber adjacent the fiber ends to thereby place tension on the substr…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.