High pressure compatible vacuum chuck for semiconductor wafer including lift mechanism
US6722642B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 6, 2002 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Nov 13, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A vacuum chuck for holding a semiconductor wafer during high pressure processing comprises a wafer platen, first through third lift pins, and an actuator mechanism. The wafer platen comprises a smooth surface, first through third lift pin holes, and a vacuum opening. In use, the vacuum opening applies vacuum to a surface of a semiconductor wafer, which chucks the semiconductor wafer to the wafer platen. The first through third lift pins mount within the first through third lift pin holes, respectively. The actuator mechanism couples the first through third lifting pins to the wafer platen. The actuator mechanism operates to extend the first through third lift pins in unison above the smooth surface of the wafer platen. The actuator mechanism operates to retract the first through third lift pins in unison to at least flush with the smooth surface of the wafer platen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.