High-reliability interposer for low cost and high reliability applications
US6723927B1 · kind B1 · utility
9Cited by
11References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 29, 2001 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Oct 1, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10378
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An interposer provides a high reliability interface between an LGA connector and a motherboard. The interposer includes a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.