Patent · US Expired

Method of calibrating a test system for semiconductor components, and test substrate

US6724181B2 · kind B2 · utility

2Cited by

7References

6Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventor

Michael Schittenhelm · Poing, DE

Key dates

Filing date	Nov 16, 2001
Grant date	Apr 20, 2004
Priority date	—
Expiry date	Nov 16, 2021

Classification

Technology area (CPC G)Physics
CPC primaryG01R31/14
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

In order to calibrate a test system for semiconductor components, use is made of a test substrate which has connecting contact points that are associated with one another in pairs. The contact points of the pairs are disposed at different distances from one another and they are connected by conductor tracks of approximately the same length. As a result, equalization of all the signal paths is achieved. In each case, a probe belonging to a probe card or a reference probe is placed onto the connecting contact points of a pair, so that the test system can be calibrated as far as a respective connecting contact of a component.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.