Test board for testing semiconductor device
US6724213B2 · kind B2 · utility
3Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 31, 2002 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Oct 31, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
There is provided a test board for testing semiconductor devices by connecting a plurality of DUTs (semiconductor devices under the test) with a test head, and transmitting test signals from the test head to the plurality of DUTs. The test board comprises a motherboard connected to the test head; a multi-layer wiring board connected to each of the plurality of DUTs; and a scramble board disposed between the motherboard and the multi-layer wiring board. The motherboard and the scramble board, and the multi-layer wiring board and the scramble board are each connected by female connectors and male connectors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.