Cleaning-apparatus line configuration and designing process therefor
US6725119B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 13, 2000 |
| Grant date | Apr 20, 2004 |
| Priority date | — |
| Expiry date | Oct 15, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S438/906
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An objective of this invention is to provide a process for selecting rationally and quickly a wet process treatment in which an etchant can be shared based on a minimum preliminary investigation while eliminating cross contamination derived from a newly employed material, in a cleaning-apparatus line configuration in a process for manufacturing a silicon semiconductor device. In advance, an element which is suspected to cause cross contamination is added to an etchant used in a wet processing, a silicon substrate is immersed in the etchant, and then a correlation between a concentration of the element adhesively remaining still on the surface of the silicon substrate after the etchant is washed out with water and a concentration of the dissolved element in the etchant. On the basis of the result, the upper concentration limit of the element remaining by cross contamination is estimated when sharing the etchant. Then, with reference to the upper limit, whether deterioration of device properties occurs is evaluated to determine acceptability of etchant sharing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.